Unwrapping the Future: Exploring Innovations and Trends in the Internet of Packaging Market(2023-203 | |
The Global Internet of Packaging Market size was reasonably estimated to be approximately USD 23970 Million in 2023 and is poised to generate revenue of over USD 47850 Million by the end of 2030, projecting a CAGR of around 10.30% from 2023 to 2030. The term Internet of Packaging market to the integration of digital technology, such as sensors, RFID tags, and connectivity solutions, into packaging materials and products. This integration enables packaging to become smart, interactive, and connected, facilitating various functionalities such as real-time tracking, monitoring, authentication, and communication throughout the supply chain and product lifecycle. The IoP ecosystem encompasses a range of applications, including inventory management, product traceability, anti-counterfeiting measures, consumer engagement, and sustainability initiatives. By leveraging IoT-enabled packaging solutions, businesses can enhance operational efficiency, improve consumer experiences, and gain valuable insights into product performance and consumer behavior. Top Key Players Covered in The Internet of Packaging Market: Avery Dennison Corporation (US), Smartrac N.V. (Netherlands), BASF SE (Germany), Thin Film Electronics Asa (Norway), Stora Enso Oyj (Finland), Tetra Pak (Switzerland), Kezzler (Norway), Digimarc Corporation (US), Evrythng Limited (UK), Thinfilm Electronics Ab (Sweden),Scanbuy Inc. (US), Identiv Inc. (US), Smart glyph Ltd. (UK), E Ink Holdings Inc. (Taiwan), Paksense Inc. (US), Schreiner Group Gmbh & Co. Kg (Germany), Smart Label Solutions (Spain), Gao Rfid Inc. (Canada) To Learn More About This Report, Request A Free Sample Copy: https://pristineintelligence.com/request-sample/internet-of-packaging-market-25 | |
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Target Prov.: All Provinces Target City : usa Last Update : Feb 26, 2024 4:37 AM Number of Views: 77 | Item Owner : akshay patil Contact Email: Contact Phone: (None) |
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