Global Top 14 Companies Accounted for 91% of total Plating Equipment market (QYResearch, 2021) | |
Semiconductor electroplating refers to the electroplating of metal ions in the electroplating solution onto the wafer surface to form metal interconnects during the chip manufacturing process. As the chip manufacturing process becomes more and more advanced, the interconnect lines in the chip begin to shift from traditional aluminum materials to copper materials, and semiconductor copper plating equipment is widely used. At present, semiconductor electroplating is not limited to the deposition of copper wires, but also metals such as tin, tin-silver alloys, nickel, and gold, but the deposition of metallic copper still dominates. Semiconductor electroplating equipment can deposit a layer of dense, no holes, no gaps and other defects on the wafer, and evenly distributed copper, and then equipped with vapor deposition equipment, etching equipment, cleaning equipment, etc., to complete the copper interconnection process. The electroplating process is used to deposit metallized films of metals such as copper, nickel, tin, silver, and gold in three-dimensional through-silicon vias, rewiring, bumps, and other processes. The global key manufacturers of Plating Equipment include Lam Research, Applied Materials, ASM Pacific Technology, EBARA, Hitachi, ACM Research, Besi (Meco), TKC, ClassOne Technology, Amerimade, etc. In 2021, the global top 10 players had a share approximately 91.0% in terms of revenue. For more information, please contact the following e-mail address: Email: global@qyresearch.com Website: https://www.qyresearch.com | |
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