Exploringthe Thermal Management in IC Substrate PCB | |
The choice of substrate material greatly influences thermal management. Materials with high thermal conductivity, such as ceramics (alumina, aluminum nitride) and certain types of laminates (metal core PCBs), are preferred for efficient heat dissipation. These are small plated-through holes in the PCB that extend from the surface to inner layers. They facilitate heat transfer from the IC to the PCB's core, where it can be spread out and dissipated more effectively. Proper placement and design of thermal vias are essential for optimal thermal performance. Contact info:- https://efpcb.mystrikingly.com/blog/exploringthe-thermal-management-in-ic-substrate-pcb | |
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Target Prov.: All Provinces Target City : Guangdong Last Update : May 04, 2024 10:57 AM Number of Views: 91 | Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206 |
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