BGA assembly (Computers - Hardware)

Item ID 3961422 in Category: Computers - Hardware

BGA assembly
X-ray is one of the testing methods for inspecting the BGA assembly solder joint while electrical tests are used in testing the electrical functionality of the product. One gets the benefit of looking through the solder joint below the BGAs. Because of this advantage, AXI, an automated X-ray inspection technique is preferred in the inspection of BGA. Contact Info:- High Quality PCB Co., Limited Office: Shajing Town, Baoan District, Shenzhen, Guangdong 518000, China Plant 1 address: Building 5-6, Fu Qiao 3rd Industrial Zone, Bao' an, Shenzhen, Guangdong, China Plant 2 address: Zhuhai, Guangdong, China Plant 3 address: Dongguan, Guangdong, China TEL: +86-755-23724206 WhatsApp: +86-189 2381 2997 Skype: shawnwang2006 Email: sales@efpcb.com
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Target Prov.: All Provinces Target City : Shenzhen Last Update : Oct 08, 2024 1:42 AM Number of Views: 71	Item Owner : Shawn Wang Contact Email: Contact Phone: +86-755-23724206

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2024-10-31 (0.576 sec)